代表性論文 |
1. Lei Su, Xiaonan Yu, Ke Li*, Jiefei Gu, Michael Pecht. Sparse Reconstruction for Micro-defect Detection of Two-dimensional Ultrasound Image Based on Blind Estimation, IEEE transactions on industrial electronics, 2020, DOI: 10.1109/TIE.2020.3021651 2. Lei Su, Xiaonan Yu, Ke Li*, Michael Pecht. Defect inspection of flip chip solder joints based on non-destructive methods: A review, Microelectronics Reliability, 2020, 110: 113657 3. Hairun Huang, Ke Li, Wensheng Su, Jianyi Bai, Zhigang Xue, Lang Zhou, Lei Su*, Michael Pecht. An improved empirical wavelet transform method for rolling bearing fault diagnosis, Science China-Technological Sciences, 2020, DOI: 10.1007/s11431-019-1522-1 4. Lei Su, Lingyu Wang*, Ke Li, Jingjing Wu, Guanglan Liao, Tielin Shi, Tingyu Lin. Automated X-ray recognition of solder bump defects based on ensemble-ELM, Science China-Technological Sciences, 2019, 62(9): 1512-1519 5.宿磊,黃海潤,李可,蘇文勝.基于LCD-MCKD的滾動軸承故障特征提取方法,華中科技大學學報(自然科學版), 2019, 47(9): 19-24 6. Ke Li, Lingyu Wang, Jingjing Wu, Qiuju Zhang, Guanglan Liao, Lei Su*. Using GA-SVM for defect inspection of flip chips based on vibration signals, Microelectronics Reliability, 2018, 81: 159-166 7. Lei Su, Tielin Shi, Zhiping Liu, Hongdi Zhou, Li Du, Guanglan Liao*. Nondestructive diagnosis of flip chips based on vibration analysis using PCA-RBF, Mechanical Systems and Signal Processing, 2017, 85: 849-856 |
